1.Design(incl. advanced logic/memory semiconductor design, low-power optimization, large-scale power semiconductor design)
2.Materials(incl. advanced packaging materials, green transformation (GX) power semiconductor materials, next-generation manufacturing component materials)
3.Support Technologies(incl. electronic design automation (EDA), evaluation and analysis technologies)
4.Manufacturing(incl. manufacturing technologies for current-generation and mature-node semiconductors, and process design kits (PDKs))
助成金額
※応募要件に記載します。
助成期間
※応募要件に記載します。
応募要件
Maximum duration ofprojects: 42 months
Funding per project:Japan side:funded by JST(direct expenses)
International joint research: Up to 105 mil. yen
Researchers’ capacity building: Up to 13.65 mil. yen/person*Indirect expenses:30% of directexpenses
Vietnam side:funded by MST
International joint research:Up to 400,000 USD